Photonics Engineer III - Phoenix Harbour (305) in Phoenix, AZ at Benchmark Electronics

Date Posted: 12/29/2020

Job Snapshot

  • Employee Type:
    Full-Time
  • Location:
    Phoenix, AZ
  • Experience:
    At least 4 year(s)
  • Date Posted:
    12/29/2020

Job Description

Benchmark provides comprehensive solutions across the entire product lifecycle; leading through its innovative technology and engineering design services, leveraging its optimized global supply chain, and delivering world-class manufacturing services. The industries we serve include: commercial aerospace, defense, advanced computing, next generation telecommunications, complex industrials, medical, and semiconductor capital equipment.

Summary:
The Photonics Packaging Engineer will design, develop and deploy innovative photonics packaging and test solutions for Benchmark customers that are highly reliable and cost competitive for volume manufacturing.

Responsibilities:
• Experience with assembly processes for microelectronic packages
• Knowledge of optical alignment, fiber attach and related equipment
• Hands on experience with prototyping and measurements of photonics packages
• Understanding of electronics and optics packaging manufacturing
• Experience with general Photonics testing, BERT, PAM4 testing a plus

Other information:
Qualifications/ Education / Experience
This list is not all inclusive. Additional duties will be assigned as needed.
• Collaborate with others on the development of optical alignment processes and performance testing procedures.
• Performs electrical, mechanical, thermal and optical measurements to quantify photonic package performance;
• Proves the feasibility of the package design and the assembly process by designing experiments, and overseeing prototype builds and reliability and stress testing;
• Identify and Defines optical component and consumable specifications to locate and develop outside suppliers;
• Oversee the development and qualification of packaging materials and conduct testing to ensure product and process performance and reliability are met.
• Document the engineering fabrication, inspection, and assembly processes and provide guidance to manufacturing for product launch.
• Collaborates with designers and process engineers, as well as the customer and external suppliers to provide designs and manufacturing processes optimized for cost, reliability and throughput;

• Experience with assembly processes for microelectronic packages
• Knowledge of optical alignment, fiber attach and related equipment
• Hands on experience driving design, prototyping and measurements of photonics packages
• Knowledge of material properties and how to apply to photonics packages
• Understanding of electronics and optics packaging design flows
• Experience with general Photonics testing, BERT, PAM4 testing a plus

• 4 year Engineering or Technical degree preferred, or equivalent combination of education and experience as approved by executive management

Education:

US:AZ:Phoenix

Shift: Shift 1

Work Schedule:  M-F 0800-1700 

Full Time

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