Sr. Manager, RF Design Engineering- Lark (276) in Tempe, AZ op Benchmark Electronics

Geplaatst op: 6/10/2021

Kort overzicht van de functie

  • Type werknemer:
    Fulltime werknemer
  • Locatie:
    Tempe, AZ
  • Ervaring:
    Greater than 15 years
  • Geplaatst op:
    6/10/2021

Functieomschrijving

Benchmark provides comprehensive solutions across the entire product lifecycle; leading through its innovative technology and engineering design services, leveraging its optimized global supply chain, and delivering world-class manufacturing services. The industries we serve include: commercial aerospace, defense, advanced computing, next generation telecommunications, complex industrials, medical, and semiconductor capital equipment.

Summary:
Benchmark is hiring an RF Design Manager for our RF and High-Speed Design Center of Excellence in Phoenix, AZ. This design center focuses on radio and high-speed solutions across multiple markets and is equipped with VHDI PCB fabrication manufacturing and well as Micro-E and SMT lines. It is designed as a one-stop shop for customer design and manufacturing requirements.

Responsibilities:
As an RF Design Manager, you will manage a team of designers tasked with designing solutions that range in scope from component level to full end-to-end systems. You will be the technical lead for all RF projects and will work with engineers of all disciplines throughout the full product development life-cycle.
Working as a hands-on designer and technical lead as part of the RF and High-Speed Design team, this person will:
•Assist senior leaders in gauging market demand and develop technical strategies to meet it.
•Provide technical oversite, project management, recruiting efforts, conduct department meetings, and annual performance reviews.
•Be the driver of technical discussions with customers as well as internal System Architects, System Integration and Test, Electrical, Mechanical, Process, Quality, and Software Engineering, PCB designers, and Sales & Marketing teams.
•Contribute to customer proposals and internal research and development proposals.
Focus will be on striking a balance of driving the team to execute on tasks while maintaining an open, collaborative environment where people are free to experiment and be creative. You must bring a combination of RF design, system expertise, test, software, PCB knowledge, and cross-functional team management experience to the position.

Key Competencies:
•Experience creating technical proposals in response to customer RFQs/RFPs, SOWs, and helping customers define project scope and requirements and acceptance criteria.
•Experience steering daily technical based issues/discussions: alignment with design, process, test, validation, and manufacturing teams.
•Actively interact with customers to ensure a high level of service quality and discern customers’ technical needs and/or possible business opportunities.
•Experience leading development teams through major program milestones including Systems Requirements Review (SRR), Preliminary Design Review (PDR), Critical Design Review (CDR), and Manufacturing Readiness Review (MRR).
•Experience creating strong teams from diverse backgrounds and fostering a positive culture to create great things.
•Strong leadership skills leading teams through different objectives while managing customer expectations.
•Provide technical mentoring and career development opportunities to engineers.
•Monitor and establish metrics for tracking project development progress through completion.
•Hands-on RF/Microwave/mmWave design experience and testing/debugging of building blocks like amplifiers, mixers, filters, PLLs, etc. in the frequency range of 1-120 GHz.
•Experience with RX/TX cascade analysis, link budget analysis, PCB layout tools and techniques of RF System/Subsystem designs at the Integrated Microwave Assembly (IMA) and/or RFIC/MMIC level.
•Converts customer specifications and/or electrical engineering concepts of high complexity to practical RF, Digital, or Mixed Technology PCB design solutions.
•Knowledge of complex PCB layouts including RF, analog, high-speed digital, mixed signal, high density BGAs (pitch ≤ 0.2mm), large FPGA designs (> 5k pins) with high density interconnection layers, and multilayer stacked microvias.
•Experience with Micro-E package design utilizing chip and wire and SMT components.
•Experience with broadband PCB designs that operate in the 1 - 120 GHz frequency range.
•Experience working in the aerospace and defense industry and having working knowledge of DoD requirements.
•Must be self-motivated, flexible, and willing to “do what it takes” to get the job done.

Other information/Qualifications:

  • 5+ years of experience managing a team of cross-functional designers.
  • Must be a US Citizen or a Green Card holder.
  • Work experience with mmWave phased array antennas and beamforming techniques and a good understanding of wave propagation is a plus.
  • Experience with space application designs and their corresponding qualification requirements is a plus.
  • Experience with miniaturization techniques and packaging RF subsystems in a small envelope is a plus.
  • Active Secret or Top Secret Clearance is a plus.

Education:

BSEE + 15 years’ experience or MSEE + 13 years’ experience or PhD + 10 years’ industry experience in radio building blocks or RF subsystem design.


US:AZ:Tempe

Shift: Shift 1

Work Schedule:  M-Th 0600-1700 

Full Time

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