Photonics Engineer III - Phoenix Harbour (305) in Phoenix, AZ at Benchmark Electronics

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Benchmark provides comprehensive solutions across the entire product lifecycle; leading through its innovative technology and engineering design services, leveraging its optimized global supply chain, and delivering world-class manufacturing services. The industries we serve include: commercial aerospace, defense, advanced computing, next generation telecommunications, complex industrials, medical, and semiconductor capital equipment.

Summary:
The Photonics Packaging Engineer will design, develop and deploy innovative photonics packaging and test solutions for Benchmark customers that are highly reliable and cost competitive for volume manufacturing.

Responsibilities:
• Experience with assembly processes for microelectronic packages
• Knowledge of optical alignment, fiber attachment and related equipment
• Hands on experience with prototyping and measurements of photonics packages
• Understanding of electronics and optics, fiber optics or photonic packaging manufacturing
• Experience with general fiber optic testing, BERT, PAM4 testing a plus

Other information:
Qualifications/ Education / Experience
This list is not all inclusive. Additional duties will be assigned as needed
• Collaborates with others on the development of fiber optic alignment processes and performance testing procedures
• Performs electrical, mechanical, thermal and optical measurements to quantify optical package performance
• Proves the feasibility of the package design and the assembly process by designing experiments, and overseeing prototype builds and reliability and stress testing
• Identifies and defines optical component and consumable specifications to locate and develop outside suppliers
• Oversees the development and qualification of packaging materials and conduct testing to ensure product and process performance and reliability are met.
• Documents the engineering fabrication, inspection, and assembly processes and provide guidance to manufacturing for product launch.
• Collaborates with designers and process engineers, as well as the customer and external suppliers to provide designs and manufacturing processes optimized for cost, reliability and throughput
• Experience with assembly processes for microelectronic packages
• Knowledge of fiber optics, fiber attachment and related equipment
• Hands on experience driving design, prototyping and measurements of optoelectronic packages and fiber optics
• Knowledge of material properties and how to apply them to optoelectronic packages
• Understanding of electronics and optics/fiber optics packaging design flows
• Experience with general fiber optic testing, BERT, PAM4 testing a plus

Education:

4 year Engineering or Technical degree preferred, or equivalent combination of education and experience as approved by executive management

US:AZ:Phoenix

Shift: Shift 1

Work Schedule:  M-F 0800-1700 

Full Time