Photonics Engineer III in Phoenix, AZ at Benchmark Electronics

发布日期: 11/17/2020

职位快速浏览

  • 求职者类型
    Full-Time
  • 工作经验:
    Not Specified
  • 发布日期:
    11/17/2020

职位描述


Job Title
Photonics Engineer III

Job ID(Requisition ID):
5117

Job Summary
The Photonics Packaging Engineer will design, develop and deploy innovative photonics packaging and test solutions for Benchmark customers that are highly reliable and cost competitive for volume manufacturing.
Essential Functions and Competencies
• Experience with assembly processes for flip-chip, wirebond, & microelectronic packages • Deep knowledge of optical alignment, fiber attach and related equipment • Hands on experience driving design, prototyping and measurements of photonics packages • Knowledge of material properties and how to apply to photonics packages • Understanding of electronics and optics packaging design flows • Experience with general Photonics testing, BERT, PAM4 testing a plus
Qualifications / Education / Experience
This list is not all inclusive. Additional duties will be assigned as needed. • Collaborate with others on the development of optical alignment processes and performance testing procedures. • Performs electrical, mechanical, thermal and optical measurements to quantify photonic package performance; • Proves the feasibility of the package design and the assembly process by designing experiments, and overseeing prototype builds and reliability and stress testing; • Identify and Defines optical component and consumable specifications to locate and develop outside suppliers; • Oversee the development and qualification of packaging materials and conduct testing to ensure product and process performance and reliability are met. • Document the engineering fabrication, inspection, and assembly processes and provide guidance to manufacturing for product launch. • Collaborates with designers and process engineers, as well as the customer and external suppliers to provide designs and manufacturing processes optimized for cost, reliability and throughput;

• Experience with assembly processes for flip-chip, wirebond, & microelectronic packages • Deep knowledge of optical alignment, fiber attach and related equipment • Hands on experience driving design, prototyping and measurements of photonics packages • Knowledge of material properties and how to apply to photonics packages • Understanding of electronics and optics packaging design flows • Experience with general Photonics testing, BERT, PAM4 testing a plus

• 4 year Engineering or Technical degree preferred, or equivalent combination of education and experience as approved by executive management
Job Category
Design Engineering
Job Location
Phoenix, Arizona

Schedule
Day
Pay Type
Salary
Travel Requirement
No
Job Type
Full-Time

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